SMT integrated module placement machine

At present, the size of components faced by circuit board assembly is getting smaller and smaller. For example, chip components have been developed from 0201 to 01005. At the same time, flip chip (Fa), chip scale packaging (CSP), and high-density stacked packaging have also appeared. (PoP) and system-in-package (SiP) and other new packaging devices, which requires that the mounting equipment must also be able to meet the mounting needs of such devices.

The SMT integrated module placement machine came into being. The SMT integrated module placement machine is a brand new concept model proposed in the development process of new placement machine equipment in recent years.

The main features of the integrated module placement machine are: taking the host of the placement machine as standard equipment, and equipping it with a unified and standard base platform and universal interface, and cutting, coating, placement and testing of bare chips, even The functions of various processes such as welding are designed as functional module components. Users can configure the required functional module components on the host according to production needs to achieve different functional requirements.

The integrated module placement machine is essentially more than just a placement machine, because it has integrated the functions of various devices on the SMT production line into a machine platform system, and realized the integration of electronic assembly equipment. One such device can complete multiple processes on the electronic assembly production line, replacing the traditional combined production line.

Obviously, due to the characteristics of functional integration, this type of placement machine is lower than the previous two types of modular placement machines in terms of single machine capacity. It is mainly oriented to multi-tasking, multi-user, multi-variety, small batch or R&D, short cycle Demand for electronic processing. When it is necessary to switch the coating and placement functions, the user only needs to exchange the coating module and the placement module, so as to complete the placement of common components and special packaged devices on one placement machine at one time, which improves the production efficiency and reliability.

For example, the CM402 module placement machine cm402. If you want to achieve free switching between a high-speed machine and a multi-function machine on a placement machine, then the CM402 with a fast switching platform is your first choice. Its high-speed mode has a production capacity of up to 60,000 CPH and has an accuracy of ±50 μm, which can correspond to substrates up to 18" x 20". Its multi-function mode production capacity also reaches 17,140 CPH and an accuracy of ±35μm.

In addition to high speed and switchability, CM402 has some other advantages. Its friendly interface makes your operation and programming easier and easier. It can achieve the rapid transmission of substrates and convenient product switching, which can minimize the loss of production utilization rate.